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Author Message
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Posted: Wed Jul 16, 2008 4:35 pm
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CALL FOR CHAPTERS
Proposals Submission Deadline: 7/30/2008
Full Chapters Due: 11/30/2008
Advances in Monolithic Microwave Integrated Circuits for Wireless
Systems: Modeling and Design Technologies
A book edited by Arjuna Marzuki and Ahmad Ismat Abdul Rahim
Universiti Sains Malaysia, Telekom R&D Malaysia, Malaysia.

Introduction
Monolithic Microwave Integrated Circuit (MMIC) is one of electronic
devices which are widely used in all high frequency wireless systems.
In developing MMIC as a product, understanding the process, analysis
techniques, design techniques, modeling, measurement methodology and
awareness of current product invention are essential. In the fields of
advanced MMIC development, there exists a need for an edited
collection of articles in this area.

Objective of the Book
The main objective of this book is to provide a central source of
reference on MMIC development which covers knowledge in process,
analysis, design, modeling, measurement and inventions. It will
contain open-solicited and invited chapters written by leading
engineers, researchers and well-known academics in relevant fields.
The book will cover the state-of-the-art as well as latest research
discoveries and applications, thus making it a valuable reference for
a large community of audiences.

Target Audience
This book will be an important reference to engineers/researchers/
academics working in the field of high frequency integrated circuit
design and its related areas such as microelectronics, electronic
device modeling, high frequency characterization and measurement, etc.
It will also be a potential resource for senior undergraduate and
postgraduate students.


Organization of the Book
Section I provides an introduction to the MMIC development. Section II
focuses on MMIC process or technology perspectives. Section III will
present the analysis, design and modeling of MMIC. Section IV will
discuss the MMIC measurement methodologies. Finally, in Section V,
invention of MMICs will be presented. Each section will be preceded by
an introduction, and the book will conclude with a summary

Recommended topics include, but are not limited to, the following:
• Design & Modeling of Pseudomorphic HEMTs using Technology Computer
Aided Design (T-CAD) Technique
• Development of Mesa & Recess Etching Process
• Development of Gate Lithography
• Development of Metallization Process
• Development of Passive Device Process
• Materials Characterization and Analysis for HEMT Structures
• Design and Modelling of Metal-Insulator-Metal Capacitor
• Design and Modelling of Mesa and Thin Film Resistor
• Design and Modelling of Spiral Inductors based on GaAs P-HEMT
Technology
• Design and Circuit Model Development for GaAs P-HEMT Transistor
• Design and Simulation of GaAs P-HEMT Medium Power Amplifier
• Design and Simulation of GaAs P-HEMT Low Noise Amplifier
• DC and RF Characterization of In-House Fabricated HEMT and Passive
Device
• On Wafer Measurement and Characterization of Si3N4 MIM Capacitor,
Thin Film Resistor, Mesa Resistor and Low Noise Amplifier
• On Wafer Measurement and Characterization of GaAs Power P-HEMT
Transistor and Medium Power Amplifier
• Low Noise Amplifier Inventions
• Power Amplifier Inventions
• Voltage-controlled oscillators Inventions
• Mixer Inventions
• Transmit and Receive Switch Inventions


Submission Procedure
Researchers and practitioners are invited to submit on or before July
30, 2008, a 2-3 page chapter proposal clearly explaining the mission
and concerns of his or her proposed chapter. Authors of accepted
proposals will be notified by August 15, 2008 about the status of
their proposals and sent chapter guidelines. Full chapters are
expected to be submitted by November 30, 2008. All submitted chapters
will be reviewed on a double-blind review basis. This book is
scheduled to be published by IGI Global (formerly Idea Group Inc.),
publisher of the “Information Science Reference” (formerly Idea Group
Reference) and “Medical Information Science Reference” imprints. For
additional information regarding the publisher, please visit www.igi-global..com.

Inquiries and submissions can be forwarded electronically (Word
document) or by mail to:

Arjuna Marzuki
School of Electrical and Electronic Engineering,
Universiti Sains Malaysia, Seri Ampangan, 14300 Nibong Tebal, Penang,
Malaysia
Tel.: +604 599 6021 • Fax: +604 594 1023
E-mail: eemarzuki at (no spam) eng.usm.my


Ahmad Ismat Abdul Rahim
Microelectronics & Nano Technology Program, Telekom Research &
Development Sdn. Bhd., Idea Tower, UPM-MTDC, Technology Incubation
Center One, Lebuh Silikon, 43400 Serdang, Selangor, Malaysia
Tel: +603 8945 9057 • Fax: +603 8941 4413,
E-mail: drismat at (no spam) tmrnd.com.my
 
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